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 2SK2473-01
FAP-II Series
> Features
High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = 30V Guarantee Avalanche Proof
N-channel MOS-FET
300V
0,2
20A
125W
> Outline Drawing
> Applications
Switching Regulators UPS DC-DC converters General Purpose Power Amplifier
> Maximum Ratings and Characteristics
- Absolute Maximum Ratings (TC=25C), unless otherwise specified
Item Drain-Source-Voltage Drain-Gate-Voltage Continous Drain Current Pulsed Drain Current Gate-Source-Voltage Max. Power Dissipation Operating and Storage Temperature Range Symbol V DS V DGR ID I D(puls) V GS PD T ch T stg Rating 300 300 20 80 30 125 150 -55 ~ +150 Unit V V A A V W C C
> Equivalent Circuit
- Electrical Characteristics (TC=25C), unless otherwise specified
Item Drain-Source Breakdown-Voltage Gate Threshhold Voltage Zero Gate Voltage Drain Current Gate Source Leakage Current Drain Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On-Time ton (ton=td(on)+tr) Turn-Off-Time toff (ton=td(off)+tf) Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge Symbol V (BR)DSS V GS(th) I DSS I R g C C C t t t t I V t Q
GSS DS(on) fs iss oss rss d(on) r d(off) f AV SD rr rr
Test conditions ID=1mA VGS=0V ID=1mA VDS=VGS VDS=300V Tch=25C VDS=0V Tch=125C VGS=30V VDS=0V ID=10A VGS=10V ID=10A VDS=25V VDS=25V VGS=0V f=1MHz VCC=150V ID=20A VGS=10V RGS=10 Tch=25C L = 100H IF=2xIDR VGS=0V Tch=25C IF=IDR VGS=0V -dIF/dt=100A/s Tch=25C
Min. 300 3,5
Typ. 4,0 10 0,2 10 0,13 10 1900 400 180 20 80 100 50 1,3 300 4,0
Max. 4,5 500 1,0 100 0,2 2850 600 270 30 120 150 75 1,9
5
20
Unit V V A mA nA S pF pF pF ns ns ns ns A V ns C
- Thermal Characteristics Item Thermal Resistance
Symbol R th(ch-a) R th(ch-c)
Test conditions channel to air channel to case
Min.
Typ.
Max. 35 1,0
Unit C/W C/W
N-channel MOS-FET
300V
0,2
2SK2473-01
FAP-II Series
Drain-Source On-State Resistance vs. Tch
RDS(on) = f(Tch); ID=10A; VGS=10V
20A
125W
> Characteristics
Typical Output Characteristics
ID=f(VDS); 80s pulse test; TC=25C
Typical Transfer Characteristics
ID=f(VGS); 80s pulse test; VDS=25V; Tch=25C
ID [A]
1
RDS(ON) []
2
ID [A]
3
VDS [V]
Tch [C]
VGS [V]
Typical Drain-Source On-State-Resistance
RDS(on)=f(ID); 80s pulse test; TC=25C
Typical Transconductance
gfs=f(ID); 80s pulse test; VDS=25V; Tch=25C
Gate Threshold Voltage
VGS(th)=f(Tch); ID=1mA; VDS=VGS
RDS(ON) []
gfs [S]
5
VGS(th) [V]
4
6
ID [A]
ID [A]
Tch [C]
Typical Capacitances
C=f(VDS); VGS=0V; f=1MHz
Typical Gate Charge Characteristics
VGS=f(Qg); ID=20A
Forward Characteristics of Reverse Diode
IF=f(VSD); 80s pulse test
C [pF]
VDS [V]
VGS [V]
IF [A]
7
8
9
VDS [V]
Qg [nC]
VSD [V]
Power Dissipation
PD = f(TC)
Safe Operation Area
ID=f(VDS): D=0,01, Tc=25C
Zth(ch-c) [K/W]
Transient Thermal impedance
Zthch=f(t) parameter:D=t/T
PD [W]
10
ID [A]
12
Tc [C]
VDS [V]
t [s]
Collmer Semiconductor - P.O. Box 702708 - Dallas TX - 75370 - 972.233.1589 - 972.233.0481 Fax - www.collmer.com - 11/98


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